Multi-CB aims to store the solder paste for no longer than 1 month. In addition, the solder paste is stored at Multi-CB. The European distributor guarantees at least 25%, i.e. Shelf life: The manufacturer guarantees 50% on delivery. LOCTITE GC 10 is suitable for use with industry standard SAC alloys. The new flux chemistry protects the solder joint longer, improves coalescence and optimizes wetting performance, allowing for very shiny solder joints. It supports excellent reflow to overcome industry wide HiP and NWO challenges. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. LOCTITE® GC 10 is a halogen free, zero halogens added, No-Clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. In the critical seasons, UPS Express Saver shipping is highly recommended, for easier transport see Loctite We ship with cooling pack in hot summer and with insulation fleece in freezing winter.
#SOLDER PASTE FOR REFLOW FREE#
Very low, REL1 < 0,15%, for halogen free see Loctiteġ2 months at room temperatur (up to 20☌), for easier storage, see Loctite In laboratory tests the solder paste showed no bridging, no tendency to tombstoning or solder bead formation on bipolar components.ĩ6.5% tin, 3% silver, 0.5% copper (SAC305) This guarantees a constant viscosity over a long period of use. In addition, ISO-Cream® "Active-Clear" is also free of any thixotropic agents that could reduce viscosity with increasing shear forces. This is particularly interesting for users who have integrated an automatic optical inspection (AOI) into their process. The soldering paste is also low in odor and forms almost colorless flux residues, which spread only to a very limited extent. ISO-Cream®"Active-Clear" offers the user the possibility to also work with a moderate print image or with more oxidized surfaces of PCB and components and still achieve excellent soldering results. In addition to the properties of the basic version ISO-Cream "Clear", special attention was paid in this further development to an optimized spread, especially on "problematic" surfaces such as chem. The ISO-Cream® "Active-Clear" has a REL1 flux classification and therefore has a low halogen content (<0.15 %) but is still a genuine NoClean paste.
The FELDER ISO-Cream® "Active-Clear" differs from the basic version ISO-Cream® "Clear" in the degree of activation.
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